Reflow Residues on Printed Circuit Board Assemblies and Interaction With Humidity
نویسندگان
چکیده
Ionic residues resulting from the soldering process is an important parameter in connection with humidity robustness of Printed Circuit Board Assemblies (PCBAs) due to their ability enhance moisture absorption and surface conductivity. For reflow process, are trapped under components, morphology can change exposure release ionic components. In this work, below components several commercial PCBAs were characterized before after conditions. used for analysis had undergone multiple heating profiles by single double plus additional passes understand effects. The upon was observed using optical scanning electron microscopy. conductivity localized extracted solutions measured NaCl equivalency determined. solder paste materials analysed water sorption property, while effect on electrical property assessed electrochemical impedance spectroscopy test PCBs. results show that level activator a function flux type, PCBA characteristics such as component standoff height number cycles. Water layer formation properties PCBs correlated part.
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ژورنال
عنوان ژورنال: IEEE Transactions on Device and Materials Reliability
سال: 2021
ISSN: ['1558-2574', '1530-4388']
DOI: https://doi.org/10.1109/tdmr.2021.3120941